ZEIT magnetron sputtering is a kind of Physical Vapor Deposition (PVD). It makes the electrons move in spiral paths near the target surface by the interaction between magnetic and electric fields, thus increasing the probability of electrons hitting argon gas to generate ions. The generated ions then hit the target surface under the action of electric field and sputter the target materials to deposite thin film on the substrate surface. The general sputtering method can be used for preparation of various metals, semiconductors, ferromagnetic materials, as well as insulated oxides, ceramics and other substances. The equipment uses PLC+ touch panel HMI control system, which can enter parameters by programmable process interface, with the functions such as single target sputtering, multi-target sequential sputtering and co-sputtering.
As a non-thermal coating technology in the field of microelectronics,magnetron sputtering deposition is widely used in Semiconductor,Displays,Magnetic recording,Optical recording,Perovskite thin-film battery,Medical treatment,Decorative coating,Anti-discoloration coating,Optical films,lightproof film,Resistive film,Superconducting film,Magnetic film,etc. Customized production available.