Magnetron Sputtering Deposition in Functional Film Field
Applications
| Applications | Specific Purpose | Material Type |
| Functional film | Superhard film | TiN, TiC |
|
Lightproof film |
Cr, AlSi, AlTi,etc | |
| Resistive film | NiCrSi, CrSi, MoTa, etc | |
| Superconducting film | YbaCuO, BiSrCaCuo | |
| Magnetic film | Fe, Co, Ni, FeMn, FeNi, etc |
Working Principle
There are many kinds of magnetron sputtering with different working principles and application objects. But there
is one thing in common: it makes the electrons run in spiral paths near the target surface by interaction between
magnetic and electric fields, thus increasing the probability of generating ions arsing from electrons hitting argon.
The generated ions then hit the target surface under the action of electric field and sputter the target materials.
Features
| Model | MSC-FF-X—X |
| Coating type | Various dielectric films such as metal film, metal oxide and AIN |
| Coating temperature range | Normal temperature to 500℃ |
| Coating vacuum chamber size | 700mm*750mm*700mm (Customizable) |
| Background vacuum | < 5×10-7mbar |
| Coating thickness | ≥ 10nm |
| Thickness control precision | ≤ ±3% |
| Maximum coating size | ≥ 100mm (Customizable) |
| Film thickness uniformity | ≤ ±0.5% |
| Substrate carrier | With planetary rotation mechanism |
| Target material | 4×4 inches(compatible with 4 inches and below) |
| Power supply | The power supplies such as DC, pulse, RF, IF and bias are optional |
| Process gas | Ar, N2, O2 |
| Note: Customized production available. | |
Coating Sample
Process Steps
→ Place the substrate for coating into the vacuum chamber;
→ Roughly vacuumize;
→ Turn on molecular pump, vacuumize at top speed, then turn on the revolution and rotation;
→ Heating the vacuum chamber until the temperature reaches the target;
→ Implement the constant temperature control;
→ Clean elements;
→ Revolve and back to the origin;
→ Coating film according to process requirements;
→ Lower temperature and stop the pump assembly after coating;
→ Stop working when the automatic operation is finished.
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