Atomic Layer Deposition in Energy Industry
Applications
| Applications | Specific Purpose |
| Energy | Crystalline silicon solar cells: passivation layer / buffer layer / transparent electrode |
| Dye-sensitized cells: photo-anode / charge recombination barrier layer | |
| Fuel cells: proton exchange membrane / cathode / electrolyte / catalyst | |
| Lithium ion battery: nanostructure anode / cathode / electrode modified coating | |
Thermoelectric materials | |
| Electrode material protection layer |
Working Principle
There are four steps in the process of atomic layer deposition:
1. Inject first precursor gas into the substrate to have an adsorption reaction with substrate surface.
2. Flush the remaining gas with inert gas.
3. Inject the second precursor gas to have a chemical reaction with the first precursor gas adsorbed on the substrate
surfaceto form film.
4. Inject inert gas again to flush the excess gas away.
Features
| Model | ALD-E-X—X |
| Coating film system | AL2O3, TiO2, ZnO, etc |
| Coating temperature range | Normal temperature to 500℃ (Customizable) |
| Coating vacuum chamber size | Inner diameter: 1200mm, Height: 500mm (Customizable) |
| Vacuum chamber structure | According to customer’s requirements |
| Background vacuum | <5×10-7mbar |
| Coating thickness | ≥0.15nm |
| Thickness control precision | ±0.1nm |
| Coating size | 200×200mm² / 400×400mm² / 1200×1200 mm², etc |
| Film thickness uniformity | ≤±0.5% |
| Precursor and carrier gas | Trimethylaluminum, titanium tetrachloride, diethyl zinc, pure water, |
| Note: Customized production available. | |
Coating Samples
Process Step
→ Place the substrate for coating into the vacuum chamber;
→ Vacuumize the vacuum chamber at high and low temperature, and rotate the substrate synchronously;
→ Start coating: the substrate is contacted with precursor in sequence and without simultaneous reaction;
→ Purge it with high-purity nitrogen gas after each reaction;
→ Stop rotating the substrate after the film thickness is up to standard and the operation of purging and cooling is
completed, then take out the substrate after the vacuum breaking conditions are met.
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